It won’t ever be able run as fast as a soldered system.
Have you installed a server CPU?
It’s really easy to fuckup and lose a few channels of memory due to the contact being bad. Right now I’ve got a 3647 Xeon phi cpu that’s refusing to train dimm a1 for _reasons_
That’s not an experience Apple wants any user of their products to have.
People running a single desktop machine are way better served by being able to upgrade RAM modules than worrying about single contacts being bad between the RAM stick and motherboard.
Yes? I wasn’t making a claim that it was better to solder everything for everyone. I’m saying the overlap between most Apple users and those people is low.
Give definitive evidence that soldered is faster, in my experience with decent contact this is not true at all. I think the general confusion is around typical ram sticks with a controller onboard and much fewer io broke out compared to the raw ram without controller which is often what you get soldered, with more io broken out.
The bga socket you chose is more for test or industrial hardware, versus desktop cpu sockets which are much slimmer and consumer friendly.
Really disingenuous, imo. It's absolutely possible for Apple to make these chips replaceable, using the heat spreader as the retaining plate.
Have you installed a server CPU?
It’s really easy to fuckup and lose a few channels of memory due to the contact being bad. Right now I’ve got a 3647 Xeon phi cpu that’s refusing to train dimm a1 for _reasons_
That’s not an experience Apple wants any user of their products to have.
Here’s an example BGA socket: https://www.ironwoodelectronics.com/products/bga-sockets/
Not something that’s going in a tiny laptop chassis.