Great question! With thermal based processes that can certainly be a problem, but it's quite different with Electrochemical Additive Manufacturing (ECAM).
The ECAM process operates at room temperature and deposits material via electrodeposition - so no melting is involved! The resulting microstructure is a fine grained structure (avg. grain size ~ 500 - 1000 nm) with fairly equiaxed grains that provide high strength and isotropic behavior. So we don't see the same challenge that say a laser based process encounters due to melting and cooling.
The ECAM process operates at room temperature and deposits material via electrodeposition - so no melting is involved! The resulting microstructure is a fine grained structure (avg. grain size ~ 500 - 1000 nm) with fairly equiaxed grains that provide high strength and isotropic behavior. So we don't see the same challenge that say a laser based process encounters due to melting and cooling.
-Fabric8Labs